Vanguard International Semiconductor Corporation and NXP Semiconductors will invest 7.8 billion U.S. dollars to set up a 300 mm semiconductor wafer manufacturing facility in Singapore, the two companies announced Wednesday.

The joint venture will begin construction of its wafer fab in the second half of this year, with initial production available to customers during 2027 and an expected output of 55,000 wafers per month in 2029.

The fab will support 130 nm to 40 nm mixed-signal, power management and analog products, targeting the automotive, industrial, consumer and mobile end markets.

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